The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2010
Filed:
Jul. 09, 2007
Ta-te Chou, Taipei, TW;
Xiong-jie Zhang, Tianjin, CN;
Xian LI, Tianjin, CN;
Hai Fu, Tianjin, CN;
Yong-qi Tian, Tianjin, CN;
Ta-Te Chou, Taipei, TW;
Xiong-Jie Zhang, Tianjin, CN;
Xian Li, Tianjin, CN;
Hai Fu, Tianjin, CN;
Yong-Qi Tian, Tianjin, CN;
Vishay General Semiconductor LLC, Hauppauge, NY (US);
Abstract
A semiconductor device mountable to a substrate is provided. The device includes a semiconductor die and an electrically conductive attachment region having a first attachment surface and a second attachment surface. The first attachment surface is arranged for electrical communication with the semiconductor die. An interlayer material is formed on the second attachment surface of the electrically conductive attachment region. The interlayer material is a thermally conductive, dielectric material. A housing at least in part encloses the semiconductor die and the interlayer material.