The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2010
Filed:
Jul. 11, 2006
Takuji Onuma, Kanagawa, JP;
Yasutaka Nakashiba, Kanagawa, JP;
Takuji Onuma, Kanagawa, JP;
Yasutaka Nakashiba, Kanagawa, JP;
NEC Electronics Corporation, Kanagawa, JP;
Abstract
A semiconductor deviceincludes an interconnect, a conductive layer(first conductive layer), an insulating layer(first insulating layer), another conductive layer(second conductive layer), another insulating layer(second insulating layer), a via plug(first via plug), and another via plug(second via plug). In the semiconductor device, the conductive layer, the insulating layerand the conductive layerconstitute a MIM capacitor (capacitor element). To be more detailed, the conductive layer, the insulating layerand the conductive layerserve as a lower electrode, an insulating capacitor film and an upper electrode, respectively. The insulating layercovers both the conductive layerand the interconnect. The insulating layerworks as the etching stopper for the via plugs