The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2010
Filed:
Aug. 01, 2006
Jennifer Y. Sun, Sunnyvale, CA (US);
LI Xu, San Jose, CA (US);
Senh Thach, Union City, CA (US);
Kelly A. Mcdonough, San Jose, CA (US);
Robert Scott Clark, San Jose, CA (US);
Jennifer Y. Sun, Sunnyvale, CA (US);
Li Xu, San Jose, CA (US);
Senh Thach, Union City, CA (US);
Kelly A. McDonough, San Jose, CA (US);
Robert Scott Clark, San Jose, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
Embodiments of the invention provide a robust bonding material suitable for joining semiconductor processing chamber components. Other embodiments provide semiconductor processing chamber components joined using a bonding material having metal filler disposed in an adhesive layer. Other embodiments include methods for manufacturing a semiconductor processing chamber component having a bonding material that includes metal filled disposed in an adhesive layer. The metal filler is suitable for reacting with halogen containing plasmas such that a halogen based metal layer is formed on the exposed portion of the bonding material upon exposure to the plasma.