The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 11, 2010

Filed:

Mar. 24, 2008
Applicants:

Benjamin N. Eldridge, Danville, CA (US);

Thomas H. Dozier, Ii, Livermore, CA (US);

Igor Y. Khandros, Orinda, CA (US);

Gaetan L. Mathieu, Varennes, CA;

William D. Smith, Sun Lakes, AZ (US);

Inventors:

Benjamin N. Eldridge, Danville, CA (US);

Thomas H. Dozier, II, Livermore, CA (US);

Igor Y. Khandros, Orinda, CA (US);

Gaetan L. Mathieu, Varennes, CA;

William D. Smith, Sun Lakes, AZ (US);

Assignee:

FormFactor, Inc., Livermore, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/02 (2006.01); G01R 31/26 (2006.01);
U.S. Cl.
CPC ...
Abstract

An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the second substrate in order to create an array of contact structures. Each contact structure may be elongate and resilient and may comprise a core that is over coated with a material that imparts desired structural properties to the contact structure.


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