The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2010
Filed:
Jul. 19, 2006
Hsien-wei Chen, Sinying, TW;
Anbiarshy Wu, Chiayi, TW;
Shih-hsun Hsu, Keelung, TW;
Shang-yun Hou, Jubei, TW;
Hsueh-chung Chen, Yonghe, TW;
Shin-puu Jeng, Hsinchu, TW;
Hsien-Wei Chen, Sinying, TW;
Anbiarshy Wu, Chiayi, TW;
Shih-Hsun Hsu, Keelung, TW;
Shang-Yun Hou, Jubei, TW;
Hsueh-Chung Chen, Yonghe, TW;
Shin-Puu Jeng, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
An interconnect structure includes at least a first interconnect layer and a second interconnect layer. Each of the first and second interconnect layers has a pad structure and each pad structure has a respective pad density. The pad density of the pad structure of the second interconnect layer is different from the pad density of the pad structure of the first interconnect layer. The pad structures of the first and second interconnect layers are connected to each other.