The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2010
Filed:
Dec. 07, 2004
Koichi Shibayama, Osaka, JP;
Koji Yonezawa, Osaka, JP;
Kazuyoshi Shiomi, Osaka, JP;
Motohiro Yagi, Osaka, JP;
Hidenobu Deguchi, Osaka, JP;
Nobuhiro Goto, Osaka, JP;
Koichi Shibayama, Osaka, JP;
Koji Yonezawa, Osaka, JP;
Kazuyoshi Shiomi, Osaka, JP;
Motohiro Yagi, Osaka, JP;
Hidenobu Deguchi, Osaka, JP;
Nobuhiro Goto, Osaka, JP;
Sekisui Chemical Co., Ltd., Osaka, JP;
Abstract
A thermosetting resin composition capable of providing a molding, such as a resin sheet, that excels in not only dielectric characteristics but also dimensional stability at high temperature and even after exposure to high temperature thermal history, exhibits little dimensional change by the thermal history, namely, exhibiting low linear expansion coefficient. There are further provided a resin sheet and resin sheet for insulated substrate produced from the thermosetting resin composition. In particular, there is provided a thermosetting resin composition comprising an epoxy resin of 100 to 2000 epoxy equivalent, an epoxy resin hardening agent consisting of a phenolated compound, and a layered silicate, and are further provided a resin sheet comprised of the thermosetting resin composition and a resin sheet for insulated substrate comprised of the resin sheet.