The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2010
Filed:
Jan. 24, 2007
Yusuke Sato, Tokyo, JP;
Nobuyoshi Maejima, Tokyo, JP;
Tomoaki Kudaishi, Tokyo, JP;
Shinji Moriyama, Tokyo, JP;
Naoki Kuroda, Tokyo, JP;
Ryota Sato, Tokyo, JP;
Masashi Okano, Tokyo, JP;
Yusuke Sato, Tokyo, JP;
Nobuyoshi Maejima, Tokyo, JP;
Tomoaki Kudaishi, Tokyo, JP;
Shinji Moriyama, Tokyo, JP;
Naoki Kuroda, Tokyo, JP;
Ryota Sato, Tokyo, JP;
Masashi Okano, Tokyo, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
A technique is provided for achieving reduction in size of an electronic device with a power amplifier circuit, while enhancing the performance of the electronic device. An RF power module for a mobile communication device includes first and second semiconductor chips, a passive component, and first and second integrated passive components, which are mounted over a wiring board. In the first semiconductor chip, MISFET elements constituting power amplifier circuits for the GSM 900 and for the DCS 1800 are formed, and a control circuit is also formed. In the first integrated passive component, a low pass filter circuit for the GSM 900 is formed, and in the second integrated passive component, a low pass filter circuit for the DCS 1800 is formed. In the second semiconductor chip, antenna switch circuits for the GSM 900 and DCS 1800 are formed. Over the upper surface of the wiring board, the second semiconductor chip is disposed next to the first semiconductor chip between the integrated passive components.