The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2010
Filed:
Dec. 19, 2006
Joachim Mahler, Regensburg, DE;
Ralf Wombacher, Maxhutte-Haidhof, DE;
Dieter Lachman, Kehlheim, DE;
Bernd Betz, Obertraubling/Oberhinkofen, DE;
Stefan Paulus, Zeitlarn, DE;
Edmund Riedl, Gebelkofen, DE;
Joachim Mahler, Regensburg, DE;
Ralf Wombacher, Maxhutte-Haidhof, DE;
Dieter Lachman, Kehlheim, DE;
Bernd Betz, Obertraubling/Oberhinkofen, DE;
Stefan Paulus, Zeitlarn, DE;
Edmund Riedl, Gebelkofen, DE;
Infineon Technologies, AG, Neubiberg, DE;
Abstract
A semiconductor device includes semiconductor device components, an adhesion promoter structure and a plastic housing composition. The semiconductor device components are embedded in the plastic housing composition with the adhesion promoter structure being disposed between the device components and the housing composition. The adhesion promoter structure includes first and second adhesion promoter layers. The first layer includes metal oxides. The metal oxides being silicates of a reactive compound composed of oxygen and organometallic molecules. The second layer includes at least one polymer.