The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 27, 2010

Filed:

Feb. 11, 2005
Applicants:

Ming LI, Fremont, CA (US);

Sayeh Khalili, San Jose, CA (US);

Donald R. Mullen, Mountain View, CA (US);

Inventors:

Ming Li, Fremont, CA (US);

Sayeh Khalili, San Jose, CA (US);

Donald R. Mullen, Mountain View, CA (US);

Assignee:

Rambus Inc., Los Altos, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
Abstract

The semiconductor package includes two electrical contacts and a semiconductor device coupled to opposing sides of a substrate. The substrate defines at least one via extending at least partially there through. The semiconductor device includes a semiconductor low-speed interface electrically coupled to one of the electrical contacts through the via, and a semiconductor high-speed interface electrically coupled to flexible tape. The flexible tape is also electrically coupled to the other one of the electrical contacts.


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