The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 27, 2010

Filed:

Aug. 30, 2007
Applicants:

Jeffrey Gambino, Westford, VT (US);

Edward Cooney, Iii, Jericho, VT (US);

Anthony Stamper, Willston, VT (US);

William Thomas Motsiff, Essex Junction, VT (US);

Michael Lane, Cortland Manor, NY (US);

Andrew Simon, Fishkill, NY (US);

Inventors:

Jeffrey Gambino, Westford, VT (US);

Edward Cooney, III, Jericho, VT (US);

Anthony Stamper, Willston, VT (US);

William Thomas Motsiff, Essex Junction, VT (US);

Michael Lane, Cortland Manor, NY (US);

Andrew Simon, Fishkill, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract

Methods are disclosed for forming dual damascene back-end-of-line (BEOL) interconnect structures using materials for the vias or studs which are different from those used for the line conductors, or using materials for the via liner which are different from those used for the trench liner, or having a via liner thickness different from that of the trench liner. Preferably, a thick refractory metal is used in the vias for improved mechanical strength while using only a thin refractory metal in the trenches to provide low resistance.


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