The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2010
Filed:
Jul. 25, 2008
Hong MA, Singapore, SG;
Shi-jie Bai, Singapore, SG;
Hong Ma, Singapore, SG;
Shi-Jie Bai, Singapore, SG;
United Microelectronics Corp., Hsinchu, TW;
Abstract
An interconnection process is described. A substrate having a conductive region formed therein is provided. A dielectric layer is formed on the substrate. A patterned metal hard mask layer having a trench opening is formed on the dielectric layer. A dielectric hard mask layer is formed conformally on the patterned metal hard mask layer and filled in the trench opening. A photoresist pattern is defined to remove a portion of the dielectric hard mask layer and a portion of the dielectric layer to form a first opening in the dielectric layer. The photoresist pattern is removed. A first etching process is performed using the patterned metal hard mask layer as a mask to form a trench and a second opening extending downward from the first opening in the dielectric layer. The second opening exposes the conductive region. A conductive layer is formed in the trench and the second opening.