The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2010
Filed:
Dec. 16, 2008
Applicant:
Daisuke Ito, Nagano, JP;
Inventor:
Daisuke Ito, Nagano, JP;
Assignee:
Shinko Electric Industries Co., Ltd., Nagano, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
After a semiconductor element is formed and before resin sealing is performed, a surface of a scribe line between the adjacent semiconductor elements of a semiconductor wafer is scraped thinly. A laser is irradiated on a broken layer of the surface of the scribe line thus scraped thinly to recrystallize the broken layer.
Ito, Daisuke. (2010). Method of manufacturing semiconductor device (U.S. Patent No. 7704857). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7704857
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile