The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 27, 2010

Filed:

Jul. 11, 2008
Applicants:

Jeong-uk Huh, Santa Clara, CA (US);

Mihaela Balseanu, Sunnyvale, CA (US);

Li-qun Xia, Santa Clara, CA (US);

Derek R. Witty, Fremont, CA (US);

Hichem M'saad, Santa Clara, CA (US);

Inventors:

Jeong-Uk Huh, Santa Clara, CA (US);

Mihaela Balseanu, Sunnyvale, CA (US);

Li-Qun Xia, Santa Clara, CA (US);

Derek R. Witty, Fremont, CA (US);

Hichem M'Saad, Santa Clara, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/336 (2006.01);
U.S. Cl.
CPC ...
Abstract

Methods of forming boron-containing films are provided. The methods include introducing a boron-containing precursor into a chamber and depositing a network comprising boron-boron bonds on a substrate by thermal decomposition or a plasma process. The network may be post-treated to remove hydrogen from the network and increase the stress of the resulting boron-containing film. The boron-containing films have a stress between about −10 GPa and 10 GPa and may be used as boron source layers or as strain-inducing layers.


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