The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 20, 2010

Filed:

Jun. 26, 2007
Applicants:

Anthony Yeh Chiing Wong, Pulau Pinang, MY;

Victor Henckel, Seattle, WA (US);

Boon Liang Heng, Kuala Lumpur, MY;

Christopher Wade Ackerman, Phoenix, AZ (US);

James C. Shipley, Gilbert, AZ (US);

Inventors:

Anthony Yeh Chiing Wong, Pulau Pinang, MY;

Victor Henckel, Seattle, WA (US);

Boon Liang Heng, Kuala Lumpur, MY;

Christopher Wade Ackerman, Phoenix, AZ (US);

James C. Shipley, Gilbert, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

In one embodiment, the present invention includes a burn-socket for insertion into a test board, where the burn-in socket is coupled to receive a semiconductor device under test (DUT). The burn-in socket includes a substrate to support the semiconductor DUT, which includes a heating element embedded in a layer of the substrate. Other embodiments are described and claimed.


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