The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 20, 2010
Filed:
Oct. 19, 2007
Moises Cases, Austin, TX (US);
Bradley Donald Herrman, Cary, NC (US);
Kent Barclay Howieson, Austin, TX (US);
Erdem Matoglu, Austin, TX (US);
Bhyrav Murthy Mutnury, Austin, TX (US);
Pravin Patel, Cary, NC (US);
Nam Huu Pham, Round Rock, TX (US);
Caleb James Wesley, Winston Salem, NC (US);
Moises Cases, Austin, TX (US);
Bradley Donald Herrman, Cary, NC (US);
Kent Barclay Howieson, Austin, TX (US);
Erdem Matoglu, Austin, TX (US);
Bhyrav Murthy Mutnury, Austin, TX (US);
Pravin Patel, Cary, NC (US);
Nam Huu Pham, Round Rock, TX (US);
Caleb James Wesley, Winston Salem, NC (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method for testing a printed circuit board to determining the dielectric loss associated with the circuit board material relative to a standard. Dielectric losses in the material generate heat when a high frequency electronic signal, such as a microwave frequency signal, is communicated through a microstrip that is embedded within the printed circuit board. The temperature or spectrum at the surface of printed circuit board is measured and compared against the temperature or spectrum of the standard to determine whether the material under test is acceptable. While various temperature measurement devices may be used, the temperature is preferably measured without contacting the surface, such as using an infrared radiation probe.