The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 20, 2010
Filed:
Sep. 18, 2007
Applicants:
Shao Jian Chen, Shanghai, CN;
Wei Qiang Jin, Shanghai, CN;
Bhoy Ching, Shanghai, CN;
Taw Ming Lau, Shanghai, CN;
Inventors:
Shao Jian Chen, Shanghai, CN;
Wei Qiang Jin, Shanghai, CN;
Bhoy Ching, Shanghai, CN;
Taw Ming Lau, Shanghai, CN;
Assignee:
Stats Chippac Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit package system includes providing an integrated circuit die having planar dimensions; forming a lead extended across one of the planar dimensions of the integrated circuit die; and applying an adhesive layer over the lead of a side opposite the integrated circuit die.