The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 20, 2010

Filed:

Mar. 31, 2006
Applicants:

Chi-wen Chen, Minsyong Township, Chiayi County, TW;

Ting-chang Chang, Hsinchu, TW;

Po-tsun Liu, Hsinchu, TW;

Kuo-yu Huang, Baoshan Township, Hsinchu County, TW;

Jen-chien Peng, Jhubei, TW;

Inventors:

Chi-Wen Chen, Minsyong Township, Chiayi County, TW;

Ting-Chang Chang, Hsinchu, TW;

Po-Tsun Liu, Hsinchu, TW;

Kuo-Yu Huang, Baoshan Township, Hsinchu County, TW;

Jen-Chien Peng, Jhubei, TW;

Assignee:

AU Optronics Corp., Hsin-Chu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

A Thin Film Transistor comprises a gate electrode formed on a substrate; a gate insulation layer covering the gate electrode; an amorphous silicon (a-Si) region disposed on the gate insulation layer and above the gate electrode; a doped a-Si region formed on the a-Si region; the source and drain metal regions separately formed on the doped a-Si region and above the gate electrode, and isolated from the a-Si region; a passivation layer formed on the gate insulation layer and covering the source, drain and data-line (DL) metal regions; and a conductive layer formed on the passivation layer. The passivation layer has a first, second and third vias for respectively exposing the partial surfaces of the source, drain and DL metal regions. The first, second and third vias are filled with the conductive layer, so that the DL and source metal regions are connected via the conductive layer.


Find Patent Forward Citations

Loading…