The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 13, 2010
Filed:
Sep. 26, 2008
Rung-an Chen, Taipei Hsien, TW;
Rung-An Chen, Taipei Hsien, TW;
Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;
Abstract
A heat dissipation apparatus () includes a heat spreader (), and first and second resilient plates () provided at two opposite sides of the heat spreader. The first resilient plate includes a mounting arm () and two fixing arms () extending from two opposite ends of the mounting arm, respectively. The mounting arm defines a first mounting hole () therein, and each of the fixing arms defines a first fixing hole () therein. The second resilient plate defines a second mounting hole () and two second fixing holes () therein. The first resilient plate is fixed on the heat spreader via the first fixing holes. The second resilient plate is fixed on the heat spreader via the second fixing holes. The heat spreader is fixed on a circuit board via the first and the second mounting holes.