The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 13, 2010
Filed:
Sep. 06, 2006
Applicants:
Junichi Nakamura, Nagano, JP;
Kinji Nagata, Nagano, JP;
Inventors:
Junichi Nakamura, Nagano, JP;
Kinji Nagata, Nagano, JP;
Assignee:
Shinko Electric Industries Co., Ltd., Nagano, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/04 (2006.01); H01L 23/498 (2006.01); H01L 23/12 (2006.01); B32B 25/10 (2006.01); H05K 3/46 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A multilayered wiring substrate is constructed by stacking wiring layersand insulating layersin predetermined number, with at least one of the wiring layers being formed as a reinforcing wiring layerwhose thickness is 35 to 150 μm arranged in one layer or plural layers. Also, the thickness of the reinforcing wiring layer is larger than that of the other wiring layers.