The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 13, 2010
Filed:
Nov. 26, 2001
Sergey D. Lopatin, Santa Clara, CA (US);
Paul R. Besser, Sunnyvale, CA (US);
Pin-chin Connie Wang, Menlo Park, CA (US);
Sergey D. Lopatin, Santa Clara, CA (US);
Paul R. Besser, Sunnyvale, CA (US);
Pin-Chin Connie Wang, Menlo Park, CA (US);
GLOBALFOUNDRIES Inc., Grand Cayman, KY;
Abstract
A method of fabricating an integrated circuit includes forming a barrier layer along lateral side walls and a bottom of a via aperture and providing a ternary copper alloy via material in the via aperture to form a via. The via aperture is configured to receive the ternary copper alloy via material and electrically connect a first conductive layer and a second conductive layer. The ternary copper alloy via material helps the via to have a lower resistance and an increased grain size with staffed grain boundaries.