The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 13, 2010
Filed:
May. 26, 2008
Yan-hsiu Liu, Tainan, TW;
Yan-Hsiu Liu, Tainan, TW;
United Microelectronics Corp., Hsin-Chu, TW;
Abstract
A method of manufacturing an integrated circuit (IC) chip is provided. The method includes the following steps. First, a substrate is provided. The substrate is divided into an internal region and an external region by a die seal ring region. A number of circuit units are then formed in the internal region on the substrate. Thereafter, a dielectric layer is formed over the substrate, interconnects are formed in the dielectric layer within the internal region, and a number of bonding pad structures are formed in the dielectric layer within the external region. Finally, a cutting process is performed along a number of scribed lines on the substrate to form a number of chips. The bonding pad structures are exposed at the sides of each chip.