The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 13, 2010
Filed:
May. 25, 2007
See Yap Ong, Singapore, SG;
SI Liang LU, Singapore, SG;
Zheng Yu Gao, Singapore, SG;
Swee Huat Lee, Singapore, SG;
See Yap Ong, Singapore, SG;
Si Liang Lu, Singapore, SG;
Zheng Yu Gao, Singapore, SG;
Swee Huat Lee, Singapore, SG;
ASM Technology Singapore Pte Ltd., Singapore, SG;
Abstract
An apparatus and method for degating is provided for separating excess molding material from encapsulated electronic packages while the electronic packages are located in a molding system. At least one holding device is coupled to a mold of the molding system, which is located such that excess molding material is molded onto at least a portion of the holding device during molding. A locking feature on the portion of the holding device locks the excess molding material such that the holding device may hold the excess molding material molded onto it to forcibly separate the excess molding material from the encapsulated electronic packages after molding.