The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2010
Filed:
Jun. 01, 2006
Gottfried Beer, Nittendorf, DE;
Christoph Kienmayer, Unterhaching, DE;
Klaus Pressel, Regensburg, DE;
Werner Simbuerger, Haar, DE;
Gottfried Beer, Nittendorf, DE;
Christoph Kienmayer, Unterhaching, DE;
Klaus Pressel, Regensburg, DE;
Werner Simbuerger, Haar, DE;
Infineon Technologies AG, Munich, DE;
Abstract
A semiconductor module () has components () for microwave engineering in a plastic casing (). The semiconductor module () has a principal surface () with an upper side () of a plastic package molding compound () and at least one active upper side () of a semiconductor chip (). Disposed on the principal surface () is a multilayered conductor track structure () which alternately comprises structured metal layers () and structured insulation layers (), where at least one of the insulation layers () and/or the plastic package molding compound () has at least one microwave insulation region.