The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2010
Filed:
Apr. 12, 2002
Ho-jeong Moon, Seoul, KR;
Kyu-jin Lee, Cheonan, KR;
Ho-Jeong Moon, Seoul, KR;
Kyu-Jin Lee, Cheonan, KR;
Samsung Electronics Co., Ltd., Gyeonggo-do, KR;
Abstract
A circuit board having heating elements and a hermetically sealed multi-chip package. The multi-chip package includes a plurality of semiconductor chips, a substrate electrically coupled to the plurality of semiconductor chips, heat dissipation means, and a plurality of thermal interfaces disposed between the semiconductor chips and the heat dissipation means. The heat dissipation means forms a hermetically sealed cavity that encloses the semiconductor chips and at least a portion of the substrate. The circuit board includes a chip mounting surface, a chip mounting area on the chip mounting surface, the chip mounting area including a plurality of lands, and heating elements connected to the lands, the heating elements capable heating a joint formed between the lands and electrode pads of a semiconductor chip.