The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2010
Filed:
Jun. 29, 2006
Yukihiro Sato, Tokyo, JP;
Norio Kido, Tokyo, JP;
Tatsuhiro Seki, Tokyo, JP;
Katsuo Ishizaka, Tokyo, JP;
Ichio Shimizu, Tokyo, JP;
Yukihiro Sato, Tokyo, JP;
Norio Kido, Tokyo, JP;
Tatsuhiro Seki, Tokyo, JP;
Katsuo Ishizaka, Tokyo, JP;
Ichio Shimizu, Tokyo, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
A semiconductor device having a plurality of chips is reduced in size. In HSOP (semiconductor device) for driving a three-phase motor, a first semiconductor chip including a pMISFET and a second semiconductor chip including an nMISFET are mounted over each of a first tab, second tab, and third tab. The drains of the pMISFET and nMISFET over each tab are electrically connected with each other. Thus, two of six MISFETs can be placed over each of three tabs divided in correspondence with the number of phases of the motor, and they can be packaged in one in a compact manner. As a result, the size of the HSOP for driving a three-phase motor, having a plurality of chips can be reduced.