The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2010

Filed:

May. 01, 2006
Applicants:

Xiangdong Feng, Upland, CA (US);

Yie-shein Her, Canandaigua, NY (US);

Anthony C. Sutorik, Milan, MI (US);

M. Sharon Paras, Howell, MI (US);

Inventors:

Xiangdong Feng, Upland, CA (US);

Yie-Shein Her, Canandaigua, NY (US);

Anthony C. Sutorik, Milan, MI (US);

M. Sharon Paras, Howell, MI (US);

Assignees:

Ferro Corporation, Cleveland, OH (US);

Nanocerox, Inc., Ann Arbor, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides substantially spherical composite ceria/titania particles, a method of forming the same, and chemical mechanical polishing compositions comprising such particles. The substantially spherical particles include a substantially crystalline core portion including one or more crystallites having a cubic lattice structure including CeTiO, where x is <0.25, and a substantially amorphous cladding covering at least a portion of the substantially crystalline core portion, the substantially amorphous cladding including TiCeO, where y is ≦0.50. The method of forming the particles includes combusting an organic solvent including a cerium salt of a carboxylic acid and a titanium (IV) chelate in a combustion supporting gas and collecting agglomerates comprising two or more substantially spherical particles. The agglomerates can be used as an abrasive material in chemical mechanical polishing compositions to remove film layers during the fabrication of integrated circuit devices.


Find Patent Forward Citations

Loading…