The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 2010
Filed:
Dec. 27, 2006
Kuniyuki Takahashi, Musashimurayama, JP;
Shinsuke Tei, Musashimurayama, JP;
Noriko Suzuki, Tachikawa, JP;
Noriko Mori, Musashimurayama, JP;
Shinji Maki, Hachioji, JP;
Kuniyuki Takahashi, Musashimurayama, JP;
Shinsuke Tei, Musashimurayama, JP;
Noriko Suzuki, Tachikawa, JP;
Noriko Mori, Musashimurayama, JP;
Shinji Maki, Hachioji, JP;
Kabushiki Kaisha Shinkawa, Tokyo, JP;
Abstract
A wire bonding apparatus including a bonding control section provided with an electrical non-bonding detector, an optical non-bonding detector, and an optical shape detector, which are for detecting non-bonding between a first bonding point and a bonding wire; and when non-bonding is detected by the electrical non-bonding detector and non-bonding is also detected by the optical non-bonding detector, then the tip end of the bonding wire is reformed by, based on the shape of the tip end of the bonding wire detected by the optical shape detector, a ball formation device into a ball of a prescribed shape, and rebonding is performed at the first bonding point.