The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2010
Filed:
Nov. 03, 2006
Applicants:
Toshihiko Saito, Atsugi, JP;
Kiyoshi Kato, Atsugi, JP;
Takehisa Sato, Isehara, JP;
Inventors:
Assignee:
Semiconductor Energy Laboratory Co., Ltd, Atsugi-shi, Kanagawa-ken, unknown;
Primary Examiner:
Int. Cl.
CPC ...
H04B 1/38 (2006.01); H04Q 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract
An object is to reduce troubles during pressure bonding of an antenna in a wireless chip including a thin film. A wireless chip made from a thin film is formed, in particular a wireless chip including a memory area including an organic compound layer, and a distance between the memory area and a pad is a prescribed value or longer. As a result, data writing can be carried out without being affected by stress or heat during pressure bonding of the antenna. For a substrate over which the wireless chip is provided, a glass substrate or a silicon wafer can be used.