The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 23, 2010

Filed:

Jun. 23, 2008
Applicants:

Xiao-yan Zhu, Shenzhen, CN;

Cui-jun LU, Shenzhen, CN;

Inventors:

Xiao-Yan Zhu, Shenzhen, CN;

Cui-Jun Lu, Shenzhen, CN;

Assignees:

Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Shenzhen, Guangdong Province, CN;

Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A memory module assembly includes a printed circuit board having a plurality of heat-generating electronic components thereon, first and second heat sinks formed by stamping a metal sheet and attached on opposite sides of the printed circuit board and a clamp clamping the first, second heat sinks and the printed circuit board together. The first and second heat sinks each comprise a plurality of fins extending therefrom and define a plurality of openings between the fins. The fins and openings are alternately arranged on each of the first and second heat sinks along a height direction thereof. The second heat sink includes a pair of positioning tongues extending from opposite side edges thereof. The first heat sink engages with the second heat sink via the positioning tongues of the second heat sink extending in and engaging with the first heat sink.


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