The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7683291 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 23, 2010

Filed:

Apr. 26, 2006
Applicants:

Kei Hayasaki, Kamakura, JP;

Tsuyoshi Shibata, Kikuchi-gun, JP;

Koutarou Sho, Yokohama, JP;

Shinichi Ito, Yokohama, JP;

Inventors:

Kei Hayasaki, Kamakura, JP;

Tsuyoshi Shibata, Kikuchi-gun, JP;

Koutarou Sho, Yokohama, JP;

Shinichi Ito, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A21B 1/00 (2006.01); C23C 16/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

According to an aspect of the invention, there is provided a single substrate processing method which continuously heats substrates to be processed to which films containing solvents are applied, by use of a heating apparatus having an opening/closing mechanism, including supplying a gas containing a solvent contained in a film of a first substrate to be processed into the heating apparatus in a closed state of the opening/closing mechanism between processing of the first substrate to be processed and processing of a second substrate to be processed.


Find Patent Forward Citations

Hayasaki, Kei. (2010). Substrate processing method and manufacturing method of semiconductor device (U.S. Patent No. 7683291). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7683291

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