The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7682983 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 23, 2010

Filed:

Jul. 17, 2006
Applicants:

Hikaru Kokura, Kawasaki, JP;

Kenji Nukui, Kawasaki, JP;

Shinji Fukuta, Kawasaki, JP;

Tadashi Oshima, Kawasaki, JP;

Fukashi Harada, Kawasaki, JP;

Tatsuro Kawabata, Kawasaki, JP;

Inventors:

Hikaru Kokura, Kawasaki, JP;

Kenji Nukui, Kawasaki, JP;

Shinji Fukuta, Kawasaki, JP;

Tadashi Oshima, Kawasaki, JP;

Fukashi Harada, Kawasaki, JP;

Tatsuro Kawabata, Kawasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); H01L 21/461 (2006.01);
U.S. Cl.
CPC ...
Abstract

A manufacturing method of an electronic device, includes the steps of: implanting P (phosphorous) ions into a substrate semiconductor region made of Si or SiGe by using a resist as a mask; ashing the resist while it is heated in a vacuum environment; and taking out the substrate, the substrate being ashing processed so that a temperature of the substrate is equal to or less than 130° C.


Find Patent Forward Citations

Kokura, Hikaru. (2010). Manufacturing method of electronic device with resist ashing (U.S. Patent No. 7682983). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7682983

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