The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2010
Filed:
Jun. 08, 2006
Hugo R. G. Burke, PontyClun, GB;
David Paul Jones, South Glamorgan, GB;
Hugo R. G. Burke, PontyClun, GB;
David Paul Jones, South Glamorgan, GB;
International Rectifier Corporation, El Segundo, CA (US);
Abstract
A process is described to enable the manufacture of a thinned (<50 μm semiconductor die) which can employ the use of standard equipment for the manufacture of the wafer and the packaging of the die singulated from the wafer. A standard thickness wafer (350 μm) first has junctions formed in its upper surface, but the surface is not yet metallized and patterned. A rigid front plate is connected to the upper surface by a removable adhesive and the wafer is back ground to its final thickness, for example, less than 50 μm. A back metal and a thick conductive backing plate are then fixed to the back metal. The rigid front plate is then removed and the front surface of the wafer is metallized and patterned. Die singulated from the wafer carry the thick permanent conductive backing plate and may be conventionally packaged as prior art 350 μm die. The wafer can initially be partially diced.