The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2010
Filed:
Mar. 11, 2008
Hsueh an Yang, Taipei, TW;
Hsueh An Yang, Taipei, TW;
Advanced Semiconductor Engineering, Inc., Pingtung, TW;
Abstract
A method for manufacturing electrical connections in wafer is provided. A plurality of openings is formed on the upper surface of a wafer by dry etching or laser drilling and then solder paste is applied to the openings. Next, the wafer is positioned in a vacuum environment and is heated to soften the solder paste. Subsequently, the vacuum is suddenly broken to have the pressure upon the upper surface of the wafer greater than that in the openings thereby pressing the molten solder paste into the openings.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile