The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2010
Filed:
Mar. 31, 2004
Masahiko Hirata, Kashiba, JP;
Toshihiko Taguchi, Saitama, JP;
Masanobu Okuyama, Mouka, JP;
Yoshitaka Toyoda, Satte, JP;
Masahiko Hirata, Kashiba, JP;
Toshihiko Taguchi, Saitama, JP;
Masanobu Okuyama, Mouka, JP;
Yoshitaka Toyoda, Satte, JP;
Senju Metal Industry Co., Ltd., Tokyo, JP;
Panasonic Corporation, Osaka, JP;
Abstract
In a solder paste formed by blending an alloy powder and a flux, the alloy powder is a powder mixture formed by mixing at least one powder of a Sn—Zn based alloy and at least one powder of a Sn—Ag based alloy. The alloys powders are blended so that the composition of the powder mixture is 5-10 mass % of Zn; 0.005-1.5 mass % of Ag; optionally at least one of 0.002-1.0 mass % of Cu, 0.005-15 mass % of Bi, 0.005-15 mass % of In, and 0.005-1.0 mass % of Sb; and a remainder of Sn.