The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2010
Filed:
Aug. 19, 2005
Toshimitsu Hirai, Chino, JP;
Shinri Sakai, Suwa, JP;
Toshimitsu Hirai, Chino, JP;
Shinri Sakai, Suwa, JP;
Seiko Epson Corporation, Toyko, JP;
Abstract
The invention provides a method of forming a wiring pattern in which a conductive material layer is formed in a pattern formation region having a first region, which is bordered by a bank pattern and has a first width, and a second region, which touches the first region and has a second width smaller than the first width, on a substrate, by discharging a droplet of a conductive material in a liquid phase using a droplet discharge device. The method includes forming the conductive material layer to cover the first region and the second region, by discharging the droplet having a diameter smaller than the first width and greater than the second width toward the first region. In this case, the droplet is discharged such that the droplet lands at a position that faces a boundary line between the first region and the second region.