The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2010
Filed:
Feb. 02, 2007
Applicants:
Zheng Yu Gao, Singapore, SG;
Shu Chuen Ho, Singapore, SG;
Inventors:
Zheng Yu Gao, Singapore, SG;
Shu Chuen Ho, Singapore, SG;
Assignee:
ASM Technology Singapore Pte Ltd, Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); B29C 45/14 (2006.01);
U.S. Cl.
CPC ...
Abstract
A molding apparatus is provided for molding a leadframe, the molding apparatus comprising a mold having a leadframe-receiving area on its surface that is configured to receive and clamp the leadframe in the leadframe-receiving area. At least one molding cavity and a plurality of vacuum suction holes formed adjacent to the molding cavity are located within the leadframe-receiving area. The vacuum suction holes are operative to evacuate air from the mold surface, especially the molding cavity, through air vents connecting the vacuum suction holes to the molding cavity.