The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 2010
Filed:
Mar. 20, 2008
Wei-min Hsiao, Kaohsiung, TW;
Wei-Min Hsiao, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A sawing method for a Micro Electro-Mechanical Systems (MEMS) semiconductor device, wherein a gum material is disposed between a wafer having at least one MEMS and a carrier, and the gum material is disposed around the MEMS. The wafer is sawed according to the position correspondingly above the gum material. Finally, the carrier and the gum material are removed. By disposing the gum material between the carrier and the wafer, the MEMS are protected, and the wafer and the MEMS can avoid the pollution of water and foreign material, so that the yield can be improved. Furthermore, the wafer is sawed from the backside till the gum material without sawing through the gum material, so that the carrier is not sawed. Therefore, the carrier can be reused, such that the cost is reduced.