The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 2010
Filed:
Sep. 06, 2007
Yukifumi Oyama, Yasu, JP;
Hidetoshi Nishiwaki, Otsu, JP;
Toshihiko Nishio, Moriyama, JP;
Kazushige Toriyama, Kyoto, JP;
Yasumitsu Orii, Ohmi, JP;
Yukifumi Oyama, Yasu, JP;
Hidetoshi Nishiwaki, Otsu, JP;
Toshihiko Nishio, Moriyama, JP;
Kazushige Toriyama, Kyoto, JP;
Yasumitsu Orii, Ohmi, JP;
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method for mounting a semiconductor part on a circuit substrate is provided, which includes preparing the semiconductor part having a surface thereof provided with a plurality of stud-bumps, preparing a solder substrate having a surface thereof on which solid-solders corresponding to respective ones of the plurality of stud-bumps are arranged, preparing the circuit substrate having a surface thereof provided with connecting pads corresponding to respective ones of the plurality of stud-bumps, attaching the corresponding solid-solders on the solder substrate to respective tip ends of the plurality of stud bumps, separating the solid-solders attached to the tip ends of the stud-bumps from the solder substrate, contacting the solid-solder attached to respective ones of the tip ends of the stud-bumps with the corresponding connecting pads, and heating the solid-solders contacted with the corresponding connecting pads thereby establishing solder connection between respective ones of the stud-bumps and the corresponding connecting pads.