The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 09, 2010

Filed:

Jul. 27, 2006
Applicants:

Tay-jian Liu, Tu-Cheng, TW;

Chao-nien Tung, Tu-Cheng, TW;

Chih-hsien Sun, Tu-Cheng, TW;

Chuen-shu Hou, Tu-Cheng, TW;

Cheng-hui Lin, Tu-Cheng, TW;

Inventors:

Tay-Jian Liu, Tu-Cheng, TW;

Chao-Nien Tung, Tu-Cheng, TW;

Chih-Hsien Sun, Tu-Cheng, TW;

Chuen-Shu Hou, Tu-Cheng, TW;

Cheng-Hui Lin, Tu-Cheng, TW;

Assignee:

Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01K 1/16 (2006.01); G01K 25/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe to be tested. A movable portion is capable of moving relative to the immovable portion and has a cooling structure defined therein for cooling the heat pipe. A receiving structure is located between the immovable portion and the movable portion for receiving the heat pipe therein. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion for thermally contacting the heat pipe in the receiving structure for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portion therein and has sidewalls thereof slidably contacting at least one of the immovable portion and the movable portion.


Find Patent Forward Citations

Loading…