The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 02, 2010

Filed:

Jun. 27, 2005
Applicants:

Munehiro Toyama, Tsukuba, JP;

Siew Fong Tai, Selangor, MY;

Kian Sin Sim, Penang, MY;

Charan K. Gurumurthy, Higley, AZ (US);

Selvy Tamil Selvamuniandy, Kedah, MY;

Inventors:

Munehiro Toyama, Tsukuba, JP;

Siew Fong Tai, Selangor, MY;

Kian Sin Sim, Penang, MY;

Charan K. Gurumurthy, Higley, AZ (US);

Selvy Tamil Selvamuniandy, Kedah, MY;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method and device for input/output connections is provided. Devices and methods for connection structure are shown with improved mechanical properties such as hardness and abrasion resistance. Land grid array structures are provided that are less expensive to manufacture due to reductions in material cost such as gold. Ball grid array structures are provided with improved resistance to corrosion during fabrication. Ball grid array structures are also provided with improved mechanical properties resulting in improved shock testing results.


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