The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2010
Filed:
Mar. 27, 2008
Kuniharu Muto, Tokyo, JP;
Toshiyuki Hata, Tokyo, JP;
Hiroshi Sato, Tokyo, JP;
Hiroi Oka, Tokyo, JP;
Osamu Ikeda, Tokyo, JP;
Kuniharu Muto, Tokyo, JP;
Toshiyuki Hata, Tokyo, JP;
Hiroshi Sato, Tokyo, JP;
Hiroi Oka, Tokyo, JP;
Osamu Ikeda, Tokyo, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
To actualize a reduction in the on-resistance of a small surface mounted package having a power MOSFET sealed therein. A silicon chip is mounted on a die pad portion integrated with leads configuring a drain lead. The silicon chip has, on the main surface thereof, a source pad and a gate pad. The backside of the silicon chip configures a drain of a power MOSFET and bonded to the upper surface of a die pad portion via an Ag paste. A lead configuring a source lead is electrically coupled to the source pad via an Al ribbon, while a lead configuring a gate lead is electrically coupled to the gate pad via an Au wire.