The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2010

Filed:

Nov. 17, 2006
Applicants:

Michael Bauer, Nittendorf, DE;

Markus Brunnbauer, Lappersdorf, DE;

Irmgard Escher-poeppel, Regensburg, DE;

Jens Pohl, Bernhardswald, DE;

Christian Stuempfl, Schwandorf, DE;

Inventors:

Michael Bauer, Nittendorf, DE;

Markus Brunnbauer, Lappersdorf, DE;

Irmgard Escher-Poeppel, Regensburg, DE;

Jens Pohl, Bernhardswald, DE;

Christian Stuempfl, Schwandorf, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

For the vertical electrical connection of a number of components, an electronic structure with at least two components has solderable connecting elements, which include at least one socket element and a solder ball stacked on the socket element. The socket element has a cylindrical core of an electrically conducting first material with a lateral surface, a bottom surface and a top surface. The core is surrounded with a cladding of an electrically insulating second material in such a way that the lateral surface of the core is covered by the cladding and the top surface and the bottom surface are kept free of the cladding.


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