The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2010
Filed:
Mar. 01, 2007
Applicants:
Kiyonori Oyu, Tokyo, JP;
Kensuke Okonogi, Tokyo, JP;
Hirotaka Kobayashi, Tokyo, JP;
Koji Hamada, Tokyo, JP;
Inventors:
Kiyonori Oyu, Tokyo, JP;
Kensuke Okonogi, Tokyo, JP;
Hirotaka Kobayashi, Tokyo, JP;
Koji Hamada, Tokyo, JP;
Assignee:
Elpida Memory, Inc., Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/322 (2006.01);
U.S. Cl.
CPC ...
Abstract
In manufacturing a semiconductor device, the first gettering layer is formed on the backside of a wafer, and the second gettering layers are then formed on the backside and side surfaces of a chip, allowing these gettering layers to serve as trapping sites against metallic contamination that generated after backside grinding in assembly processes.