The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2010
Filed:
Feb. 26, 2004
Katsumi Shibayama, Hamamatsu, JP;
Yutaka Kusuyama, Hamamatsu, JP;
Masahiro Hayashi, Hamamatsu, JP;
Hamamatsu Photonics K.K., Hamamatsu-shi, Shizuoka, JP;
Abstract
A wiring substrate to which a semiconductor elementis connected, is a wiring substratecomprised of a glass substrate with through-hole groupsd, each group consisting of a plurality of through holesc extending from input surfacea to output surfaceb and formed in a predetermined array, and conductive membersformed on respective inner walls of the through holesc in each through-hole groupd so as to establish electrical continuity between input surfacea and output surfaceb. A bump electrodeof semiconductor elementconnected to the input surfacea corresponds to each through-hole groupd, conductive member, and conductive partformed in a region covering the through-hole groupd, and is connected so that a portion of the bump electrodeenters into an interior of each of the through holesc. This provides a semiconductor device in which good connection is made between the semiconductor element and the corresponding conduction path in the wiring substrate, and a radiation detector using it.