The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2010
Filed:
Nov. 02, 2006
Kazuhiko Sugiura, Nagoya, JP;
Kenichi Yokoyama, Nagoya, JP;
Muneo Tamura, Nagoya, JP;
Tetsuo Fujii, Toyohashi, JP;
Makoto Asai, Kariya, JP;
Kazuhiko Sugiura, Nagoya, JP;
Kenichi Yokoyama, Nagoya, JP;
Muneo Tamura, Nagoya, JP;
Tetsuo Fujii, Toyohashi, JP;
Makoto Asai, Kariya, JP;
DENSO CORPORATION, Kariya, JP;
Abstract
A separating device for separating a semiconductor substrate includes: a cutting element for cutting the semiconductor substrate into a plurality of chips along with a cutting line on the semiconductor substrate; an adsorbing element for adsorbing a dust on a surface of the semiconductor substrate by using electrostatic force; and a static electricity generating element for generating static electricity and for controlling the static electricity in order to remove the dust from the adsorbing element.