The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2010
Filed:
Jul. 20, 2007
Michael Bauer, Nittendorf, DE;
Ludwig Heitzer, Regensburg, DE;
Jens Pohl, Bernhardswald, DE;
Peter Strobel, Regensburg, DE;
Christian Stuempfl, Schwandorf, DE;
Michael Bauer, Nittendorf, DE;
Ludwig Heitzer, Regensburg, DE;
Jens Pohl, Bernhardswald, DE;
Peter Strobel, Regensburg, DE;
Christian Stuempfl, Schwandorf, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
An electronic circuit in a package-on-package configuration includes: a lower subassembly with a first electronic element, a first wiring carrier, a first housing with a first redistribution layer and an arrangement of solder balls disposed on the first redistribution layer and an upper subassembly with a second electronic element mounted on the lower subassembly. A method for producing the electronic circuit in a package-on-package configuration includes: adhering an upper side of the first electronic element to an underside of the first redistribution layer via a radiation-crosslinking thermoplastic adhesive.