The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2010
Filed:
Feb. 28, 2005
David C. Noice, Palo Alto, CA (US);
William Kao, Fremont, CA (US);
Inhwan Seo, Fremont, CA (US);
Xiaopeng Dong, San Jose, CA (US);
Gary W. Nunn, Los Gatos, CA (US);
David C. Noice, Palo Alto, CA (US);
William Kao, Fremont, CA (US);
Inhwan Seo, Fremont, CA (US);
Xiaopeng Dong, San Jose, CA (US);
Gary W. Nunn, Los Gatos, CA (US);
Cadence Design Systems, Inc., San Jose, CA (US);
Abstract
Disclosed is an improved method and system for implementing metal fill for an integrated circuit design. When an engineering change order is implemented, the existing dummy metal fill geometries are initially ignored when modifying the layout, even if this results in shorts and/or other DRC violations. Once the ECO changes have been implemented, those violations caused by interaction between the changes and the metal fill are repaired afterwards.