The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2010
Filed:
Jul. 12, 2007
Louis Hsu, Fishkill, NY (US);
Timothy Dalton, Ridgefield, CT (US);
Lawrence Clevenger, Lagrangeville, NY (US);
Carl Radens, Lagrangeville, NY (US);
Kwong Hon Wong, Wappingers Falls, NY (US);
Chih-chao Yang, Beacon, NY (US);
Louis Hsu, Fishkill, NY (US);
Timothy Dalton, Ridgefield, CT (US);
Lawrence Clevenger, Lagrangeville, NY (US);
Carl Radens, Lagrangeville, NY (US);
Kwong Hon Wong, Wappingers Falls, NY (US);
Chih-Chao Yang, Beacon, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method of fabricating a MEMS switch that is fully integratable in a semiconductor fabrication line. The method consists of forming two posts, each end thereof terminating in a cap; a rigid movable conductive plate having a surface terminating in a ring in each of two opposing edges, the rings being loosely connected to guiding posts; forming upper and lower electrode pairs and upper and lower interconnect wiring lines connected and disconnected by the rigid movable conductive plate. The conductive plate moves up, shorting two upper interconnect wirings lines. Conversely, the conductive plate moves down when the voltage is applied to the lower electrode pair, while the upper electrode pair is grounded, shorting the two lower interconnect wiring lines and opening the upper wiring lines.