The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2010
Filed:
Sep. 05, 2008
Michio Horiuchi, Nagano, JP;
Fumimasa Katagiri, Nagano, JP;
Shigeaki Suganuma, Nagano, JP;
Yasue Tokutake, Nagano, JP;
Jun Yoshiike, Nagano, JP;
Michio Horiuchi, Nagano, JP;
Fumimasa Katagiri, Nagano, JP;
Shigeaki Suganuma, Nagano, JP;
Yasue Tokutake, Nagano, JP;
Jun Yoshiike, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano, JP;
Abstract
There is provided a multilayer wiring substrate on which at least one semiconductor element is mounted. The multilayer wiring substrate includes: a baseboard; a first wiring layer formed on the baseboard and having a plurality of first wiring portions; an insulating layer formed on the baseboard; a second wiring layer formed on the insulating layer and having a plurality of second wiring portions, the second wiring portions being electrically connected to each other via a conductor wire, the conductor wire being arranged within the insulating layer three-dimensionally in a curved manner; and conductor portions configured to pass through the insulating layer and connecting the first wiring portions and the second wiring portions.