The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 19, 2010

Filed:

Sep. 26, 2005
Applicants:

Tetsuo Hatakeyama, Yokohama, JP;

Takashi Shinohe, Yokosuka, JP;

Inventors:

Tetsuo Hatakeyama, Yokohama, JP;

Takashi Shinohe, Yokosuka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/861 (2006.01); H01L 29/872 (2006.01); H01L 29/74 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device includes an SiC substrate, a normal direction of the substrate surface being off from a <0001> or <000-1> direction in an off direction, an SiC layer formed on the SiC substrate, a junction forming region formed in a substantially central portion of the SiC layer, a junction termination region formed to surround the junction forming region, and including a semiconductor region of a conductivity type different from the SiC layer formed as a substantially quadrangular doughnut ring, having two edges facing each other, each crossing a projection direction, which is obtained when the off direction is projected on the upper surface of the SiC layer, at a right angle, wherein a width of one of the two edges on an upper stream side of the off direction is L, that of the other edge on a down stream side is L, and a relation L>Lis satisfied.


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